
Ebara Corp. Unveils Semiconductor Manufacturing Solution: Model LPCMN Exhaust Gas Abatement System
The Model LPCMN neutralizes process gases by reducing byproduct adhesion and NOx/COx emissions and offers a compact design, hydrogen fuel options, and high airflow capacity.
EBARA Corp. plans to unveil the Model LPCMN combustion-based exhaust gas abatement system, with sales beginning in January 2025. The system is designed to neutralize process gases in semiconductor manufacturing using four primary features:
- Reduction of Byproduct Adhesion and NOx/COx Emissions
- The Model LPCMN features a high destruction and removal efficiency of more than 95% with hard-to-decompose gases like CF4. It uses a dual-stage combustion burner that minimizes byproduct adhesion in the gas processing chamber, reducing NOx and COx pollutants.
- Compact Design for Low Footprint
- The system’s height is approximately 50% reduced over previous models to enable more upper-space usage in semiconductor manufacturing facilities.
- Hydrogen Fuel Option
- The Model LPCMN burns conventional fossil fuels, but now includes hydrogen fuel options for customers electing sustainable energy operation.
- Maximum Airflow Capacity
- Similar to the Model TND, the new unit features a high airflow capacity of 600L/min.
System Background & Specifications
The semiconductor manufacturing sector uses numerous specialized gases that require safe abatement and the reduction of reactive byproducts, which may interrupt continuous operation. Model LPCMN addresses these challenges by enhancing processing and durability performance over EBARA’s previous Model TND.
Further specifications include:
- Four inlet connections, with a six-inlet model expected in 2025
- Dimensions of 1200 x 700 x 900
- Hydrogen, city gas, and propane fuel options
- Compatible with ALD, PE-CVD, LP-CVD, and etching
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